e-Smart® Technologies, Inc., Announces Next Generation Superthin Polyimide Flexible Circuit Biometric Super Smart Card™ card, the ‘i am’™ Card

NEW YORK — e-Smart® Technologies, Inc.and its parent IVI Smart Technologies, Inc., (“e-Smart®” or the “Company”) are pleased to announce that in December 2007, the Company completed manufacture and testing of its next generation superthin polyimide flexible circuit biometric card. The name of the new card is “i am.”™

The Company has now established the production infrastructure for its next generation of Super Smart Card™ cards in Korea. The new “i am”™ Super Smart Cards are made with a super adhesion technology and a superthin polyimide flexible circuit that is produced by a continuous in-line manufacturing process. The new “i am”™ cards have a super strong adhesive substrate that secures its external surface to its internal circuitry which is anchored into a plastic substrate body in the plastic material of the card’s main body. The embedded MPU instantly verifies the identity of the cardholder by comparing the cardholder’s fingerprint to the registered and encrypted fingerprint template stored in the card and the processor simultaneously communicates with ISO’s standardized card readers and other devices. The new superthin polyimide flexible circuit with super adhesion technology and infrastructure enables our new “i am”™ cards to be produced at lower costs, while providing higher security and what experts believe to be a tamper proof card body and counterfeit proof smart card.

The new Super Smart Card will be marketed under the Company’s “i am”™ trademark. Photographs of the “i am”™ card can be found on e-Smart’s website at www.e-smart.com.

In October of 2007, the Company was awarded U.S. Patent No. 7,278,025 covering aspects of the “i am”™ card and has other patent applications pending. The Company has established its manufacturing and production process capability in Korea, considered the leading country in the use of credit card and security cards.

Tamio Saito, CTO of e-Smart said, “I am honored to be part of such a dedicated group of men and women who understand that the future safety and security of the world may depend on our efforts today. Many hours were expended by a very talented and dedicated team of engineers to create this cutting edge new “i am”™ Super Smart Card™ technology, and I feel sure that it will have a beneficial impact and make a very positive difference in the world.”

Mary Grace, CEO of e-Smart said “This is a major development for the Company. While our great team of inventors and engineers has always strived to continually improve our original Super Smart Card™ design, the advances made with the newest next generation “i am”™ Super Smart Card™ far exceed our early expectations. It is my belief that with the “i am”™ card to protect people’s identity, safety and security, they will be able to say, with confidence and empowerment - “i am”™ safe, “i am”™ secure, “i am”™ cleared, - “i am”™ a voice to be heard, “i am”™ somebody, “i am”™ important – “i am.”™”

e-Smart® Technologies, Inc., is the exclusive supplier of the Biometric Verification Security™ (BVS2™) system, the “i am”™ card and the Super Smart Card™ system and related system technologies for Asia, Africa and the U.S., which e-Smart® believes to be the world’s first smartcard of its kind with an on-card sensor and a full match on-card system and other unique technologies for secure biometric ID verification. e-Smart’s® next generation technologies allow governments, public and private institutions, healthcare providers and insurers, companies large and small, to provide a superior level of protection. The “I am”™ card, Super Smart Card™ system and BVS2™ security system can secure countries from criminal and terrorist threats, stop ID and payment fraud, along with identity theft in connection with physical and logical access and financial transactions, including telephone, Internet payment and other financial and data related transactions all while protecting individual privacy.