NXP Semiconductors announced a new SWP-SIM secure element platform that combines passport level security, flash memory, smart card performance and multi-application support.
Designed to boost security in mobile transactions, the new secure element incorporates SmartMX2 technology, NXP’s next generation of secure elements, which have been deployed almost 1.5 billion times in eGovernment, banking and transport applications, according to the company.
With the new secure element, NXP says it can now offer its multi-application security architecture in all form factors – e.g. embedded, microSD, SWP-SIM – to the entire mobile market regardless of form factor preference.
According to NXP, the new platform provides a “tamper-resistant vault” for sensitive consumer data (i.e. financial information) and paves the way for accelerated deployment of NFC technology.
NXP says it will work with key SIM OS players to deliver this product to market, but has yet to announce a release date.
“The SIM market is experiencing a disruption, evolving from the non-secure basic microcontrollers found in today’s phones to high-performance, tamper-resistant secure element platforms,” said Mark Hung, Gartner’s Research Director of Wireless. “This transformation is driven by the increasing interest in NFC from mobile network operators and handset manufacturers alike, as well as the emergence of sophisticated secure applications. This transition is expected to accelerate in the coming years.”