NXP wins supply contract for Chinese e-passports
20 October, 2009
category: Contactless, Government
NXP’s SmartMX security chip has been chosen by the Chinese government to power the country’s first e-passport. The Chinese government’s intent is to replace its 30 million paper-based passports currently in circulation beginning next year.
NXP’s SmartMX chips include several security features including light and lasers and a dedicated hardware firewall to protect specific sections of the chip. NXP is currently involved in more than 80% of all e-passport projects, having shipped about 150 million ICs to date.