HID Global has developed a new a manufacturing process that enables use of some of the world’s smallest integrated low-frequency (LF) chips ever produced for contactless ID applications.
The company’s direct bonding technology can mount an antenna to a micro-sized chip surface less than 0.3 millimeters square – smaller then the pinpoint of a needle. The integrated chips use less material, which enables production efficiency for chip manufactures as well as increasingly smaller form factors for finished RFID tag products.
In addition to providing reduced unit cost and tag size, HID Global’s patented technology for bonding such small chips also offers RFID system engineers more design options. In space-restricted applications, engineers can now design smaller form factors without compromising performance.
Key applications in which these chip/antenna combinations have potential are glass tags for animal identification. Smaller glass tags are less intrusive, especially tags designed for subcutaneous implant.
Where read range is important, a small chip also makes room for a larger antenna for improved performance over a comparably sized tag with a conventional chip. Uncompromised read range performance also reduces trauma to laboratory animals and pets.