02 Feb, 2005New production introduces a leaner, meaner, chip card package
Infineon Technologies AG and Giesecke & Devrient GmbH (G&D) have jointly developed a new production method for chip packages specifically for use in chip card applications. The FCOS (Flip Chip On Substrate) method is the first in which a chip card IC is rotated or flipped inside the module housing it. The functional side of […]
